High-bandwidth memory for accelerators uses the same production lines as the ordinary DRAM in laptops and phones. Manufacturers chased the higher-margin product, and consumer prices followed. New capacity is under construction but will not ship in volume before 2028.
Who absorbs the cost
Device makers are shipping configurations with less memory at the same price, and enterprise buyers are extending refresh cycles. Expect the squeeze to last at least two more quarters.
Key takeaways
- HBM demand crowds out consumer DRAM
- New fabs arrive in 2028
- Devices ship with less memory at same price
This story is part of our ongoing coverage of hardware. We will update it as more details emerge.
